Convection-conduction Cooled Chassis
Rugged convection-conduction cooled VPX/OpenVPX Architecture chassis
designed for aerospace and defense applications.
Overview
Mistral's rugged Forced air conduction cooled OpenVPX Architecture chassis designed for aerospace and defense applications combines durability, cooling techniques, and robust performance. This chassis features a sturdy build capable of withstanding harsh environments, including extreme temperatures, shock, vibration, and high altitudes. It utilizes Forced air conduction cooling methods, where heat generated by internal electronic loads is efficiently dissipated through a combination of conducted heat transfer to the chassis side walls (conduction) and air flow (forced convection with fan), to maximize heat dissipation and maintain optimal operating temperatures for critical components.
Key features include a sealed internal shell to protect against dust, moisture, and electromagnetic interference (EMI), ensuring reliable operation in challenging conditions. The chassis is made from lightweight, high-strength materials like aluminium alloy, providing an optimal balance between weight and durability.
The chassis incorporates ruggedized connectors including MIL-grade circular connectors to ensure secure and reliable connections under harsh environmental conditions.
TECHNICAL SPECIFICATIONS
- VPX/OpenVPX Architecture
- 3U High ATR Chassis with up to 8-slots for cards
- 3U VPX and RF Hybrid Backplane options
- 230v AC or 28v DC input
- Input Transients as per MIL-STD-704E / MIL-STD-1275D
- EMI/RFI Power Line Filtering
- MIL-C-38999 type connectors for power and I/O signals
- Built using aero-grade aluminum 6061 T6
- Hard mount/custom design options
- Compliant to MIL-STD-810F & MIL-STD-461G
- Low weight, ideal for applications where the weight is critical
